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| AMMC-6241 26-43 GHz Low Noise Amplifier Data Sheet Chip Size: 1900 x 800 mm (74.8 x 31.5 mils) Chip Size Tolerance: 10 mm ( 0.4 mils) Chip Thickness: 100 10 mm (4 0.4 mils) RF Pad Dimensions: 110 x 90 mm (4.3 x 3.5 mils) DC Pad Dimensions: 100 x 100 mm (3.9 x 3.9 mils) Description Avago Technologies AMMC-6241 is a high gain, lownoise amplifier that operates from 26 GHz to 43 GHz. This LNA provides a wide-band solution for system design since it covers several bands, thus, reduces part inventory. The device has input / output match to 50 Ohm, is unconditionally stable and can be used as either primary or sub-sequential low noise gain stage. By eliminating the complex tuning and assembly processes typically required by hybrid (discrete-FET) amplifiers, the AMMC-6241 is a cost-effective alternative in the 26 - 43 GHz communications receivers. The backside of the chip is both RF and DC ground. This helps simplify the assembly process and reduces assembly related performance variations and costs. It is fabricated in a PHEMT process to provide exceptional noise and gain performance. For improved reliability and moisture protection, the die is passivated at the active areas. Features * Wide frequency range: 26 - 43 GHz * High gain: 20 dB * Low 50 Noise Figure: 2.7 dB * 50 Input and Output Match * Flat Gain Response * Single 3V Supply Bias Applications * Microwave Radio systems * Satellite VSAT, DBS Up/Down Link * LMDS & Pt-Pt mmW Long Haul * Broadband Wireless Access (including 802.16 and 802.20 WiMax) * WLL and MMDS loops * Commercial Grade Military AMMC-6241 Absolute Maximum Ratings[1] Symbol Vd Vg Id Pin Tch Tstg Tmax Parameters/Conditions Positive Drain Voltage Gate Supply Voltage Drain Current CW Input Power Operating Channel Temp. Storage Case Temp. Maximum Assembly Temp (60 sec max) Units V V mA dBm C C C -65 Min. Max. 7 NA 100 15 +150 +150 +300 Note: These devices are ESD sensitive. The following precautions are strongly recommended. Ensure that an ESD approved carrier is used when dice are transported from one destination to another. Personal grounding is to be worn at all times when handling these devices. For more details, refer to Avago Technologies Application Note A004R: Electrostatic Discharge Damage and Control. ESD Machine Model (Class A) ESD Human Body Model (Class 0) Note: Operation in excess of any one of these conditions may result in permanent damage to this device. AMMC-6241 DC Specifications/Physical Properties [1] Sy m b o l Id q ch -b P aram eters and Test Co nd itio ns D rain S u p ply C u rren t (u n der an y RF p ow er d rive an d tem p erature) ( V d = 3.0 V) Th erm al R esistan ce [2] (B acksid e tem p eratu re, Tb = 25 C ) U nits M in. Typ. mA C /W 60 25 M ax . 80 AMMC-6241 RF Specifications [3, 4, 5] TA= 25C, Vd=3.0 V, Id(Q)=60 mA, Zin=Zo=50 Parameters and Symbol Test Conditions Gain NF P-1dB OIP3 RLin RLout Isol Small-signal Gain [6] Units Minimum dB dB dBm dBm dB dB dB Typical Maximum Sigma 1.0 26-35 GHz = 20 26-37 GHz = 21 35-40 GHz = 18.5 37-40 GHz = 19.5 26-37 GHz = 2.7 37-40 GHz = 3.0 +10 +20 -13 -16 -40 -11 -12 Noise Figure into 50 Output Power at 1dB Gain Compression Third Order Intercept Point; f=100MHz; Pin=-35dBm Input Return Loss[6] Output Return Loss[6] Reverse Isolation[6] 26-37 GHz = 3.0 0.05 37-40 GHz = 3.3 0.40 0.50 0.50 Notes: 1. Ambient operational temperature TA=25C unless otherwise noted. 2. Channel-to-backside Thermal Resistance (qch-b) = 26C/W at T channel (T c) = 34C as measured using infrared microscopy. Thermal Resistance at backside temperature (Tb) = 25C calculated from measured data. 3. Small/Large -signal data measured in wafer form TA = 25C. 4. 100% on-wafer RF test is done at frequency =30, 32, and 38 GHz. 5. Specifications are derived from measurements in a 50 W test environment. Aspects of the amplifier performance may be improved over a more narrow bandwidth by application of additional conjugate, linearity, or low noise (Gopt) matching. 6. As derived from measured s-parameters USL LSL USL 2.6 2.7 2.8 2.9 19 20 2.8 2.9 3 3.1 3.2 3.3 Noise Figure at 32 GHz Gain at 38 GHz Noise Figure at 38GHz Typical distribution of Small Signal Gain, Noise Figure, and Return Loss. Based on 1500 part sampled over several production lots. 2 AMMC-6241 Typical Performances (TA = 25C, Vd1 = Vd2 =3.0 V, Itotal = 60 mA, Zin = Zout = 50 unless otherwise stated) NOTE: These measurements are in a 50 W test environment. Aspects of the amplifier performance may be improved over a narrower bandwidth by application of additional conjugate, linearity, or low noise (Gopt) matching. 25 20 0 -10 S12 (dB) 0 S21 (dB) 15 10 5 0 25 -30 -40 -50 S11 (dB) -20 -5 -10 -15 -60 -70 25 29 33 37 41 45 Frequency (GHz) -20 25 29 33 37 41 Frequency (GHz) 45 29 33 37 41 Frequency (GHz) 45 Figure 1. Typical Gain Figure 2. Typical Isolation Figure 3 Typical Input Return Loss 0 -5 3.5 3.0 25 OIP3 & OP1dB (dBm) 20 15 10 5 0 27 31 35 39 Frequency (GHz) 43 OIP3 OP-1dB S22 (dB) -10 -15 -20 -25 25 NF (dB) 29 33 37 41 45 Frequency (GHz) 2.5 2.0 1.5 1.0 26 28 30 32 34 36 38 40 Frequency (GHz) Figure 4. Typical Output Return Loss Figure 5. Typical Noise Figure into a 50 load. Figure 6. Typical Output P-1dB and 3rd Order Intercept Point. 30 25 S21 (dB) 0 25C -40C +85C S11 (dB) 0 25C -40C +85C 20 15 10 5 0 25 25C -40C +85C 29 33 37 41 Frequency (GHz) 45 S12 (dB) -20 -5 -40 -10 -60 -15 -80 25 29 33 37 41 Frequency (GHz) 45 -20 25 29 33 37 41 Frequency (GHz) 45 Figure 7. Gain Over Temperature Figure 8. Isolation Over Temperature Figure 9. Input Return Loss Over Temperature 3 AMMC-6241 Typical Performances (TA = 25C, Vd1= Vd2 =3.0 V, Itotal =60 mA, Zin = Zout = 50 unless otherwise stated) NOTE: These measurements are in a 50 W test environment. Aspects of the amplifier performance may be improved over a narrower bandwidth by application of additional conjugate, linearity, or low noise (Gopt) matching. 0 -5 S22 (dB) 4.5 66 25C -40C +85C NF (dB) 4.0 3.5 3.0 2.5 2.0 1.5 +25C -40C +85C 64 Idd (mA) -10 -15 -20 -25 -30 25 62 60 58 56 3 3.5 4 4.5 Vdd (V) 5 -40C +25C +85C 29 33 37 41 Frequency (GHz) 45 1.0 26 28 30 32 34 36 38 40 Frequency (GHz) Figure 10. Output Return Loss Over Temperature Figure 11. Noise Figure Over Temperature Figure 12. Typical Total Idd over Temperature 25 20 0 3V 4V 5V 0 3V 4V 5V -5 -20 S21 (dB) S12 (dB) 15 10 5 0 25 3V 4V 5V 30 35 40 45 Frequency (GHz) S11 (dB) -40 -10 -60 -15 -80 25 30 35 40 Frequency (GHz) 45 -20 25 30 35 40 45 Frequency (GHz) Figure 13. Gain over Vdd Figure 14. Isolation Over Vdd Figure 15. Input RL Over Vdd 0 -5 3V 4V 5V OIP3 (dBm) 29 S22 (dB) 24 -10 -15 -20 19 14 9 3V 4V 5V 31 35 39 Frequency (GHz) 43 -25 25 30 35 40 45 Frequency (GHz) 4 27 Figure 16. Output RL Over Vdd Figure 17. Output IP3 Over Vdd 4 AMMC-6241 Typical Scattering Parameters[1] (Tc=25C, VD1=VD2= 3 V, Itotal= 60 mA ,Zin = Zout = 50 ) Note: Data obtained from on-wafer measurements Freq GHz 15.0 17.0 19.0 22.0 24.0 25.0 26.0 26.5 27.0 27.5 28.0 28.5 29.0 29.5 30.0 30.5 31.0 31.5 32.0 32.5 33.0 33.5 34.0 34.5 35.0 35.5 36.0 36.5 37.0 37.5 38.0 38.5 39.0 39.5 40.0 40.5 41.0 41.5 42.0 42.5 43.0 44.0 45.0 46.0 47.0 48.0 49.0 50.0 S11 dB -1.013 -1.306 -1.528 -2.642 -5.557 -8.397 -11.117 -11.627 -11.731 -11.805 -11.787 -12.038 -12.076 -12.070 -12.259 -12.339 -12.699 -12.988 -13.131 -13.159 -13.040 -12.824 -12.498 -12.573 -12.710 -12.792 -13.029 -13.389 -13.752 -13.599 -13.511 -13.392 -13.449 -13.713 -13.892 -13.822 -13.857 -13.578 -13.775 -13.188 -13.131 -11.798 -10.167 -8.784 -7.425 -6.079 -4.403 -2.878 Mag 0.890 0.860 0.839 0.738 0.527 0.380 0.278 0.262 0.259 0.257 0.257 0.250 0.249 0.249 0.244 0.242 0.232 0.224 0.221 0.220 0.223 0.228 0.237 0.235 0.231 0.229 0.223 0.214 0.205 0.209 0.211 0.214 0.213 0.206 0.202 0.204 0.203 0.209 0.205 0.219 0.221 0.257 0.310 0.364 0.425 0.497 0.602 0.718 Phase 173.506 152.019 127.230 74.942 13.805 -29.421 -81.009 -106.817 -129.432 -149.942 -165.515 -176.581 173.456 165.646 159.454 154.710 150.567 148.382 146.592 145.349 145.137 143.097 140.155 138.158 134.590 131.388 130.988 129.322 130.820 130.535 131.737 130.598 130.777 130.341 130.693 131.722 133.603 134.336 136.724 139.343 142.382 146.033 147.240 144.663 139.414 135.513 128.030 120.056 S21 dB -7.637 5.022 9.344 15.740 19.561 20.760 21.155 21.214 21.239 21.203 21.113 21.023 21.060 21.058 21.007 21.043 21.040 21.078 21.104 21.192 21.308 21.302 21.296 21.182 21.024 20.813 20.678 20.494 20.310 20.239 20.142 19.955 19.742 19.463 19.274 19.016 18.830 18.631 18.429 18.218 18.030 17.887 17.877 17.791 17.680 17.700 17.793 17.615 Mag 0.415 1.783 2.932 6.123 9.507 10.915 11.422 11.501 11.533 11.485 11.367 11.250 11.297 11.296 11.229 11.276 11.272 11.322 11.355 11.471 11.625 11.617 11.609 11.458 11.251 10.981 10.811 10.585 10.364 10.279 10.165 9.948 9.708 9.400 9.198 8.929 8.740 8.542 8.346 8.145 7.970 7.841 7.831 7.755 7.656 7.673 7.756 7.599 Phase -94.306 163.635 75.144 -29.058 -103.326 -143.267 178.829 160.796 143.152 126.214 110.350 95.138 80.037 65.449 51.326 37.629 23.753 10.265 -3.075 -16.397 -30.578 -44.533 -58.173 -72.363 -85.797 -98.385 -111.390 -123.674 -136.026 -147.683 -160.235 -172.253 175.463 164.088 152.397 141.026 129.648 118.871 107.881 97.768 87.333 67.235 45.991 24.481 2.691 -19.090 -43.456 -66.790 S12 dB -59.891 -74.194 -58.181 -71.353 -69.197 -73.597 -69.288 -58.793 -59.928 -58.475 -58.768 -57.465 -57.267 -55.391 -52.903 -55.427 -55.992 -53.178 -61.593 -56.515 -58.069 -54.981 -56.012 -54.348 -55.336 -57.651 -54.494 -54.425 -52.515 -52.954 -52.864 -53.785 -51.373 -54.373 -56.900 -60.282 -54.278 -51.010 -54.346 -52.144 -58.236 -59.155 -52.882 -52.831 -50.765 -53.926 -52.746 -49.370 Mag 0.001 0.000 0.001 0.000 0.000 0.000 0.000 0.001 0.001 0.001 0.001 0.001 0.001 0.002 0.002 0.002 0.002 0.002 0.001 0.001 0.001 0.002 0.002 0.002 0.002 0.001 0.002 0.002 0.002 0.002 0.002 0.002 0.003 0.002 0.001 0.001 0.002 0.003 0.002 0.002 0.001 0.001 0.002 0.002 0.003 0.002 0.002 0.003 Phase 132.755 57.784 46.460 -129.404 139.800 -65.707 169.237 -110.455 -142.525 -171.775 -162.445 158.458 169.607 168.814 134.843 92.750 109.517 109.357 76.010 131.534 100.560 85.525 113.052 84.952 50.316 106.642 104.628 83.500 90.790 67.823 57.307 81.931 54.256 53.324 27.630 22.819 32.324 -8.926 41.468 19.887 -38.809 -43.306 162.395 -14.230 -17.966 -12.616 110.943 18.237 S22 dB -10.443 -14.828 -20.040 -27.825 -28.011 -24.449 -23.448 -22.500 -22.260 -21.694 -21.715 -21.674 -21.093 -21.180 -21.033 -19.948 -19.390 -18.631 -18.449 -18.461 -17.807 -18.223 -18.033 -17.550 -17.667 -17.466 -17.225 -16.978 -17.004 -16.551 -16.813 -17.019 -17.453 -17.967 -18.409 -18.887 -19.364 -19.483 -19.835 -19.299 -19.365 -17.525 -17.185 -17.248 -16.593 -15.788 -15.204 -14.953 Mag 0.301 0.181 0.100 0.041 0.040 0.060 0.067 0.075 0.077 0.082 0.082 0.082 0.088 0.087 0.089 0.101 0.107 0.117 0.120 0.119 0.129 0.123 0.125 0.133 0.131 0.134 0.138 0.142 0.141 0.149 0.144 0.141 0.134 0.126 0.120 0.114 0.108 0.106 0.102 0.108 0.108 0.133 0.138 0.137 0.148 0.162 0.174 0.179 Phase 129.202 102.094 80.180 4.390 -90.859 -110.024 -127.918 -137.132 -143.296 -148.929 -157.855 -156.390 -165.820 -168.128 -165.016 -169.860 -174.803 -177.679 173.486 168.589 164.643 157.797 155.542 150.830 145.841 143.100 137.833 131.310 127.335 120.618 113.724 107.173 100.864 97.791 94.365 92.964 92.290 92.508 94.045 94.187 93.694 90.759 81.030 74.975 69.936 60.992 57.597 47.450 5 AMMC-6241 Typical Scattering Parameters[1] (Tc=25C, VD1=VD2= 5 V, Itotal= 65 mA, Zin = Zout = 50 ) Note: Data obtained from on-wafer measurements S11 Freq GHz dB 15.0 -0.954 17.0 -1.228 19.0 -1.693 22.0 -4.463 24.0 -10.804 25.0 -15.616 26.0 -15.749 26.5 -14.388 27.0 -13.469 27.5 -12.672 28.0 -12.138 28.5 -11.933 29.0 -11.570 29.5 -11.350 30.0 -11.555 30.5 -11.254 31.0 -11.283 31.5 -11.322 32.0 -11.104 32.5 -10.807 33.0 -10.496 33.5 -10.547 34.0 -10.404 34.5 -10.415 35.0 -10.362 35.5 -10.429 36.0 -10.496 36.5 -10.552 37.0 -10.420 37.5 -10.278 38.0 -10.279 38.5 -10.249 39.0 -10.210 39.5 -10.178 40.0 -10.306 40.5 -10.258 41.0 -10.127 41.5 -10.264 42.0 -10.032 42.5 -10.283 43.0 -10.126 44.0 -10.167 45.0 -9.783 46.0 -9.264 47.0 -8.307 48.0 -7.300 49.0 -5.323 50.0 -2.732 Mag 0.896 0.868 0.823 0.598 0.288 0.166 0.163 0.191 0.212 0.232 0.247 0.253 0.264 0.271 0.264 0.274 0.273 0.272 0.278 0.288 0.299 0.297 0.302 0.301 0.303 0.301 0.299 0.297 0.301 0.306 0.306 0.307 0.309 0.310 0.305 0.307 0.312 0.307 0.315 0.306 0.312 0.310 0.324 0.344 0.384 0.432 0.542 0.730 Phase 175.370 153.538 127.796 72.488 7.846 -49.454 -118.695 -142.095 -157.405 -168.987 -179.012 175.281 168.288 163.120 160.007 157.772 155.500 152.983 151.391 149.758 147.850 145.153 143.126 140.889 138.559 136.295 134.946 133.658 132.618 132.713 130.938 128.628 128.373 126.565 125.591 125.375 124.344 124.574 123.150 124.307 121.899 124.109 125.766 127.464 129.119 129.338 131.169 130.750 S21 dB -8.236 4.910 9.038 14.671 17.336 17.926 18.185 18.195 18.134 18.081 18.015 17.898 17.844 17.735 17.591 17.515 17.405 17.327 17.244 17.048 16.850 16.638 16.371 16.064 15.807 15.574 15.279 15.017 14.810 14.595 14.400 14.210 14.060 13.885 13.784 13.652 13.606 13.621 13.524 13.509 13.579 13.792 14.185 14.828 15.605 16.576 17.761 18.988 Mag 0.387 1.760 2.831 5.415 7.359 7.876 8.114 8.123 8.067 8.018 7.957 7.850 7.802 7.704 7.578 7.512 7.417 7.351 7.281 7.118 6.959 6.790 6.585 6.356 6.171 6.008 5.807 5.635 5.502 5.367 5.248 5.134 5.047 4.946 4.889 4.815 4.790 4.798 4.745 4.736 4.775 4.893 5.120 5.513 6.029 6.742 7.727 8.900 Phase -97.484 149.468 54.112 -60.910 -139.132 -177.892 145.637 127.785 111.019 94.474 78.323 63.047 47.754 32.835 18.567 4.174 -9.721 -23.446 -37.449 -51.248 -64.998 -78.200 -91.518 -103.678 -115.864 -127.653 -138.958 -150.079 -161.113 -171.710 177.346 167.047 156.768 147.006 137.311 127.521 117.909 107.923 98.584 89.573 80.311 61.548 42.684 23.764 3.192 -18.746 -44.350 -72.015 S12 dB -58.789 -58.503 -64.600 -64.010 -64.039 -63.440 -66.326 -60.997 -63.857 -62.998 -58.768 -60.915 -63.581 -62.100 -60.126 -60.519 -56.518 -56.438 -60.113 -62.866 -60.915 -64.266 -55.886 -58.954 -56.036 -59.955 -54.224 -65.294 -57.283 -54.466 -55.347 -53.201 -54.049 -52.533 -54.574 -58.441 -57.963 -63.136 -57.167 -54.474 -60.628 -51.744 -46.879 -49.932 -46.375 -47.935 -44.298 -41.210 Mag 0.001 0.001 0.001 0.001 0.001 0.001 0.000 0.001 0.001 0.001 0.001 0.001 0.001 0.001 0.001 0.001 0.001 0.002 0.001 0.001 0.001 0.001 0.002 0.001 0.002 0.001 0.002 0.001 0.001 0.002 0.002 0.002 0.002 0.002 0.002 0.001 0.001 0.001 0.001 0.002 0.001 0.003 0.005 0.003 0.005 0.004 0.006 0.009 Phase 74.582 111.433 82.329 104.610 -127.800 -139.623 135.455 147.814 107.728 160.703 154.081 142.052 137.503 146.597 95.390 109.746 129.344 93.162 102.403 109.088 105.331 126.300 113.278 93.294 103.385 155.593 99.686 97.414 119.408 88.985 118.334 103.431 75.833 92.297 69.756 108.679 67.753 22.773 59.413 112.809 127.139 153.671 122.651 96.883 107.536 100.387 78.726 80.639 S22 dB -9.268 -12.649 -15.405 -17.425 -17.988 -18.079 -18.089 -18.056 -17.926 -18.032 -18.015 -17.578 -17.990 -18.079 -17.595 -17.674 -17.733 -17.607 -17.794 -17.546 -17.643 -17.286 -16.680 -16.775 -16.586 -16.405 -16.368 -16.046 -15.743 -15.643 -15.366 -15.139 -14.871 -14.738 -14.487 -14.153 -13.736 -13.394 -13.059 -12.764 -12.652 -12.185 -11.784 -11.499 -10.948 -10.276 -9.333 -8.077 Mag 0.344 0.233 0.170 0.135 0.126 0.125 0.125 0.125 0.127 0.125 0.126 0.132 0.126 0.125 0.132 0.131 0.130 0.132 0.129 0.133 0.131 0.137 0.147 0.145 0.148 0.151 0.152 0.158 0.163 0.165 0.170 0.175 0.180 0.183 0.189 0.196 0.206 0.214 0.222 0.230 0.233 0.246 0.258 0.266 0.284 0.306 0.341 0.395 Phase 119.399 86.348 56.944 4.474 -25.688 -40.543 -51.511 -56.680 -61.943 -67.733 -70.838 -75.742 -81.550 -83.191 -87.204 -91.933 -94.827 -97.411 -99.657 -101.921 -104.875 -105.042 -110.187 -113.869 -114.914 -117.350 -119.576 -122.641 -125.742 -129.586 -131.580 -134.722 -136.323 -139.034 -141.707 -145.685 -149.614 -152.750 -157.118 -161.086 -164.450 -174.591 177.006 170.747 163.908 155.748 147.162 136.626 6 Biasing and Operation The AMMC-6241 is normally biased with a positive supply connected to both VD1 and VD2 bond pads through the 100pF bypass capacitor as shown in Figure 21. The recommended supply voltage is 3 V. It is important to place the bypass capacitor as close to the die as possible. No negative gate bias voltage is needed for the AMMC-6241. Input and output matching are achieved on-die, therefore no other external component is required besides one 100pF bypass capacitor for the main supply. The input and output are DC-blocked with internal coupling capacitors. No ground wires are needed because all ground connections are made with plated through-holes to the backside of the device. Refer the Absolute Maximum Ratings table for allowed DC and thermal conditions. fillet around the bottom perimeter of the chip or shim. The ground plan should be free of any residue that may jeopardize electrical or mechanical attachment. The location of the RF bond pads is shown in Figure 12. Note that all the RF input and output ports are in a Ground-Signal-Ground configuration. RF connections should be kept as short as reasonable to minimize performance degradation due to undesirable series inductance. A single bond wire is normally sufficient for signal connections, however double bonding with 0.7 mil gold wire or use of gold mesh [2] is recommended for best performance, especially near the high end of the frequency band. Thermosonic wedge bonding is preferred method for wire attachment to the bond pads. Gold mesh can be attached using a 2 mil round tracking tool and a tool force of approximately 22 grams and a ultrasonic power of roughly 55 dB for a duration of 76 +/- 8 mS. The guided wedge at an untrasonic power level of 64 dB can be used for 0.7 mil wire. The recommended wire bond stage temperature is 150 +/- 2C. Caution should be taken to not exceed the Absolute Maximum Notes: [1] Ablebond 84-1 LM1 silver epoxy is recommended. [2] Buckbee-Mears Corporation, St. Paul, MN, 800-262-3824 Assembly Techniques The backside of the MMIC chip is RF ground. For microstrip applications the chip should be attached directly to the ground plane (e.g. circuit carrier or heatsink) using electrically conductive epoxy [1] For best performance, the topside of the MMIC should be brought up to the same height as the circuit surrounding it. This can be accomplished by mounting a gold plate metal shim (same length and width as the MMIC) under the chip which is of correct thickness to make the chip and adjacent circuit the same height. The amount of epoxy used for the chip and/or shim attachment should be just enough to provide a thin VD1 VD2 RFou RFin Figure 18. AMMC-6241 Simplified Schematic 7 VD1 800 790 1110 VD2 1445 705 350 RFin 350 RFout 0 0 90 1810 1900 Figure 19. AMMC-6241 Bonding pad locations To DD DC supply V 100 pF Capacitor V D1 VD2 RF INPUT AMMC-6241 RF OUTPUT Gold Plated Shim (Optional) Figure 20. AMMC-6241 Assembly diagram Ordering Information: AMMC-6241-W10 = 10 devices per tray AMMC-6241-W50 = 50 devices per tray For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Pte. All rights reserved. Obsoletes 5989-3943EN AV01-0231EN - June 2, 2006 |
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